The 13th China Henan International Investment and Trade Fair was held in Zhengzhou from April 8th to 11th. The exhibition venue of this year's CIFIT is located in Zhengzhou International Convention and Exhibition Center with a total exhibition area of 54,000 square meters. The China University of Geosciences (Beijing) Zhengzhou Research Institute debuted for the first time. The special booth (2E-05) is located in the intelligent manufacturing and service exhibition area.
Zhao Zhidan, director of the Science and Technology Department of China University of Geosciences (Beijing), Yang Xiaogang, deputy director, deputy director of the School of Engineering and Technology, Zheng Wen, deputy director of Zhengzhou Research Institute, and CEO of Mesdaff, Zhengzhou Research Institute Chang Zhengbo, Assistant Dean of School of Materials Science and Engineering, Henan University of Technology, Wang Haikuo, deputy dean of Zhengzhou Research Institute, Ph.D., China University of Geosciences (Beijing), and deputy dean of Zhengzhou Research Institute, Ding Shunshun, attended the exhibition.
Leaders from the Henan Provincial Department of Commerce, the Ministry of Industry and Information Technology, the Zhengzhou Municipal Government, and other foreign companies such as Italy, the United States, and Bolivia visited the booth.
The key enterprises and institutions participating in the intelligent manufacturing and service exhibition area of this CIFIT are: Huawei, ZTE Corporation, Inspur Group, CLP Information Industry Co., Ltd., China Railway Seventh Bureau Group Overseas Company, Tsinghua University Tianjin High-end Equipment Research Institute, China University of Geosciences (Beijing) Zhengzhou Research Institute, China Railway Engineering Equipment Group Co., Ltd., AVIC Zhengzhou Aircraft Equipment Co., Ltd., Henan Machinery Design and Research Institute Co., Ltd., Zhengzhou Abrasives Grinding Research Institute Co., Ltd. Henan Xinda New Imaging Technology Center Co., Ltd., Zhengzhou Smart Environment Robot Industry Research Institute Co., Ltd., etc.
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